SiP System-in-Package Design and Simulation by Suny Li (Li Yang)
Requirements: .PDF reader, 62,1 MB
Overview: Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.
Genre: Non-Fiction > Tech & Devices
Download Instructions:
https://userscloud.com/20b8l1hgmqfw
(Banned Filehost) http://www.file-upload.com/d1x8gzj6zxs2
Requirements: .PDF reader, 62,1 MB
Overview: Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.
Genre: Non-Fiction > Tech & Devices
Download Instructions:
https://userscloud.com/20b8l1hgmqfw
(Banned Filehost) http://www.file-upload.com/d1x8gzj6zxs2